The increase in the use of smartphones and the incorporation of printed, electronic solutions and printed logic into consumer products is creating a global billion-dollar industry.
The development of next-generation printed and flexible microelectronics presents a number of manufacturing challenges. With devices produced on thin, flexible, typically a polymer, films rather than rigid wafers, new technologies are required to convert processed sheets into individual components.
OpTek Systems precision laser processing delivers the solution to a number of manufacturing steps including, hard coding of PROM, singulation of individual die from printed sheets, and release of the bond between the die and its glass carrier wafer. The fully automated process allows for high-speed conversion from printed wafer to die on tape, or label, for downstream integration.
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