OpTek Systems provides precision laser wire stripping solutions for the controlled removal of coatings from fine wires used in medical devices, electronics, sensors, and other high-performance applications.

Laser Stripping Fine Wire Processing SEM Image at 50um
Laser Stripping Fine Wire Processing SEM Image at 100um
Laser Stripping Fine Wire Processing SEM Image at 50um

Using advanced laser processing technology, we enable highly accurate laser coating removal without mechanical contact, helping manufacturers achieve repeatable results while protecting delicate wire substrates. Whether your application requires micro wire stripping, PTFE coating removal, or complex selective coating removal, OpTek can develop a process tailored to your production requirements.

What is Laser Wire Stripping?

Laser wire stripping is a non-contact manufacturing process that removes polymer coatings from wire surfaces using precisely controlled laser energy.

Unlike mechanical stripping methods that rely on blades or abrasive contact, laser ablation wire stripping selectively removes the coating while minimizing stress on the underlying conductor. This enables manufacturers to process increasingly smaller wires, tighter tolerances, and more complex device designs.

Laser wire stripping is particularly valuable for applications requiring:

  • Fine and ultra-fine wire processing
  • Consistent strip lengths
  • Localized coating removal
  • High repeatability
  • Automated production
  • Reduced risk of wire damage

Benefits of Laser Ablation Wire Stripping

Precision Coating Removal

Accurately remove coatings from defined locations while maintaining tight process control.

Non-Contact Processing

No blades, tooling wear, or mechanical forces acting on delicate wire structures.

Improved Repeatability

Achieve consistent stripping performance across prototype, validation, and production programs.

Automation Ready

Integrate laser wire stripping into automated manufacturing workflows for increased throughput and reduced operator variability.

Reduced Risk of Damage

Controlled laser energy minimizes the risk of nicks, scratches, and deformation commonly associated with conventional stripping methods.

Flexible Process Development

Process parameters can be optimized for specific wire materials, coating types, and stripping geometries.

Micro Wire Stripping For Precision Applications

As medical devices, sensors, and electronic assemblies continue to shrink, manufacturers require increasingly precise methods for preparing fine conductors.

OpTek's micro wire stripping capabilities support applications where conventional stripping methods may struggle to achieve the required levels of accuracy and consistency.

Guidewires

Guidewires

Implantable Medical Device

Implantable Medical Devices

Neurovascular Devices

Neurovascular Devices

Catheter Components

Catheter Components

Electrode Wires

Electrode Wires

Microelectronics Interconnects

Microelectronic Interconnects

Laser Coating Removal Capabilities

OpTek develops customized laser coating removal processes for a wide range of wire constructions and coating systems.

Our engineering team works with customers to optimize process parameters based on coating thickness, material properties, strip length requirements, and production throughput targets.

PTFE Coating Removal and Polymer Processing

PTFE is widely used in medical and industrial wire applications because of its low friction characteristics and chemical resistance. However, PTFE can be challenging to remove consistently using conventional stripping methods.

OpTek's laser processing expertise enables precise PTFE coating removal while maintaining control of the underlying wire geometry.

Multilayer removal – selective removal of composite from PE and PE from platinum. Overall diameter 120µm.
Multilayer removal: Selective removal of composite from PE and PE from platinum. Overall diameter 120µm.

In addition to PTFE, we support processing of:

  • ETFE
  • FEP
  • Polyimide
  • Parylene
  • Fluoropolymer coatings
  • Medical-grade polymer coatings
  • Custom coating systems
Refractory metal cut wire – flat face burr free cutting of 300µm Molybdenum wire.

Refractory metal cut wire – flat face burr free cutting of 300µm Molybdenum wire.

Why Work with OpTek Systems?

OpTek Systems combines expertise in lasers, optics, automation, software, and precision manufacturing to deliver production-ready laser processing solutions. From process development through automated manufacturing systems, we help customers transform complex processing requirements into repeatable, scalable production solutions.

 

 

 

 

PRECISION ENGINEERED SOLUTIONS

Laser processes developed around your application requirements.

OpTek laser technician operating laser machine in lab coat
OpTek engineer inspecting inside laser machine

 

 

 

 

MANUFACTURING EXPERTISE

Extensive experience supporting precision wire processing and laser micromachining applications.

 

 

 

 

PROCESS DEVELOPMENT THROUGH PRODUCTION

Support from feasibility studies and prototyping through manufacturing implementation.

Lab coat and lab gloves place metal into laser machine
Microscope inspection of fiber in lab

 

 

 

 

AUTOMATION INTEGRATION

Production-ready systems designed for repeatability, throughput, and long-term reliability.

Ready to Discuss your Wire Stripping Applications?

Whether you are evaluating laser wire stripping for a new product or looking to improve an existing manufacturing process, OpTek can help identify the most effective solution for your requirements.

Speak to our experts

Provide us with your information and our service team will contact you