Laser Scribing

Laser scribing encompasses a number of terms including micro scribing and thin film scribing and is used to create precisely controlled, fine-scale grooves or write fine lines into films and coating layers. Laser energy can be applied to the material in one of two ways, either focused to a small spot and scanned over the surface or imaged through a mask to project the pattern onto the surface. The use of laser scribing allows for very accurate writing of fine features both in the surface of a material and by the removal of one or more layers in a multi-layer substrate.

Through the use of precision laser processing, it is possible to selectively target individual layers in thin film devices, such as capacitors and batteries, creating a highly versatile patterning process. The laser process can be tuned to remove one deposited layer from another or from the underlying substrate, which is critical for the processing of isolation scribes in thin film capacitor production. Through careful selection of the laser type and process parameters, virtually any material can be scribed, including those that are highly reflective or transparent.

Laser scribing and selective layer processing of precisely controlled structures can be achieved in the majority of materials, including transparent coatings on transparent substrates such as those used in the display and Photovoltaic industries. Selective laser machining also allows for the removal of metallic layers and coatings with little or no machining of the underlying substrate. Very fine lines can be written to create high-density circuitry and functional or decorative patterns. Thin oxide layers on flexible and rigid materials may be laser scribed to determine conductive and non-conductive areas.

OpTeks' thin-film laser scribing can also be used to modify coating materials functional properties, modifying resistance or reflectivity for example.

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