Laser patterning of thin films is used to create conducting and/or isolating paths in coated and multilayer materials. A range of techniques are employed to achieve the required result, whether to write electrical circuits in a metal-coated substrate, isolate areas of a transparent conducting oxide (TCO), or create conductive paths in printed layers or coatings that contain conducting particles.

Laser patterning offers a number of distinct advantages over other techniques:

•    Versatility in the ability to address a range of conducting, insulating, semiconductor and hybrid materials

•    Ultra-fine feature size with track or feature widths down to a few microns

•    Direct writing capability, avoiding the need for masks and wet post-processing

•    Ability to pattern 2D & 3D materials and components (including cylinders, spheres, complex surfaces)

•    Register to existing features using vision systems for accurate alignment without the need for mechanical referencing

•    Tune devices to optimize electrical performance

•    Ability to make or break electrical continuity


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