Laser Stripping by OpTek Systems

After the introduction of the first commercial CO2 laser wire stripping machine, there arose a growing demand for further advancements in laser technology. This demand was fuelled by the need to accommodate a wider array of insulating materials and wire types.

The catalysts for this need included the emergence of novel insulation varieties, innovative methods of applying insulating material to wire, varying bonding characteristics, and a shift toward smaller, lighter wire applications. Concurrently, new products utilizing these wires were also being developed across aerospace, defence, medical and consumer electronic applications.

Conventional wire stripping techniques had evolved to encompass mechanical, abrasive, chemical, and thermal methods. Nevertheless, each of these methods carried its own set of associated issues, ranging from conductor damage and sluggish processing speeds to imprecise results and subpar quality.

In this article, we will delve into the significance of laser stripping for non-fiber medical devices and how OpTek Systems is pioneering this transformative process.

The utilization of lasers for the full or partial removal of insulation or coating layers from electrical wires, catheters, and various medical devices has become a standard practice, owing to the multitude of advantages it offers. Lasers can remove such coating layers from single or multifilar wires and single or multilumen catheters. The high resolution of the laser light (theoretically its wavelength) can focus on individual wire strands or lumens to enable specific functionality of the device.

Firstly, laser stripping provides consistently high-quality results owing to its inherent nature. When employing a suitable laser for stripping polymer insulation from a wire conductor, the laser energy is efficiently absorbed by the insulation while being highly reflected by the underlying metal conductor. This reflective property of the conductor eliminates any risk of damage during the stripping process. Regardless of the wire's size, laser stripping can be applied without jeopardizing the integrity of the conductor.

Furthermore, laser stripping machines exhibit remarkable versatility, capable of handling wires and cables in various shapes, including round, out-of-round, and flat ribbon. This is primarily due to the fact that it's a non-contact process and the laser beam can be meticulously controlled, allowing for the creation of a wide array of stripping patterns, some of which are nearly impossible to achieve through other methods.

OpTek's innovative laser stripping processes include

This exceptional ability to direct the laser beam for various stripping patterns not only enhances precision but also opens up new possibilities that would be challenging or even impossible to achieve with alternative methods.

Another notable advantage lies in the user-friendliness of the laser stripping process. Unlike mechanical stripping methods, there are no blades to replace or consumables to replenish, simplifying maintenance and operation. Additionally, it is a non-contact process, eliminating components that wear out and reducing maintenance requirements.

Laser stripping machines come in a variety of types, each with different wavelengths, enabling users to select a laser that readily absorbs the layer to be removed while strongly reflecting from the underlying material.

Moreover, laser strippers can be seamlessly integrated into both semi-automatic and fully automated processes. In semi-automatic setups, operators merely present the material to the machine, ideal for end stripping, whether for single ends or batch processing. Full integration with downstream cut-and-strip machines allows for automated measuring, cutting, and stripping.

Furthermore, laser stripping ensures no damage to the metal conductor, even if it's plated with metals like tin or silver. This reduces the need for extensive quality assurance measures and allows for tighter tolerances and lighter-weight wires.

Advantages also include the ability to process nearly all insulation types, versatility in handling various wire sizes and forms, precise tolerances of +/- 25 µm (0.001 inch) for precision applications, and the capability to program variable strip patterns to remove insulation at any desired location on the wire. These benefits collectively contribute to reproducible results, increased productivity, and cost reduction.

In the realm of medical device manufacturing, the meticulous selection of wires and cables, along with their precise processing, holds immense significance. Sometimes, this choice can even mean the distinction between life and death. Laser wire stripping emerges as a dependable method to ensure superior processing quality across a spectrum of medical applications.